MECHANIC XGSP30 XGSP40 XGSP50 Sn63/Pb37 Soldering Paste Flux For Soldering Iron Station Flux Circuit Board Repair Tool

Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on good soldering and welding tool.
Unleaded MECHANIC BGA Solder Flux Paste Soldering Tin Cream Professional for BGA Soldering Iron Station.
Leaded solder paste, 183 ℃, the degree of melting point, easy welding, easy molding.

Product Specifications
Size: XGSP30-20Gram   XGSP40-35Gram XGSP50-42Gram
Alloy: Sn63/Pb37.
Microns: 20-38um.
Melting point：183°C
Application: for BGA motherboard soldering iron station flux cream.
Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.